We analyzed the temperature distribution of heat conduction due to heat generation from the chip in a structure composed of a chip, substrate, edge guide, and case.
**Case Overview**
■Product Name: Femap Thermal
■Analysis: Thermal Analysis
■Industry: Mechanical Components
Modeling can be challenging when it comes to thermally connecting components due to thermal resistance from contact or thermal conduction at adhesive points. By using the thermal coupling feature, it is possible to define conductive conductance, thermal conductivity, or thermal resistance values between distant meshes that do not share nodes, allowing for thermal coupling between these meshes in calculations. This is an excellent feature that automatically considers the positional relationships of elements and allocates the degree of thermal coupling for each element. In this analysis case, we will analyze the temperature distribution due to heat generation from a chip in a structure consisting of four types of components: chip, substrate, edge guide, and case. The adhesion between the chip and substrate, as well as the edge guide that connects the substrate and case, were modeled using thermal coupling.
□ For other functions and details, please refer to the catalog.
![[Example] Thermal conduction analysis using thermal coupling functionality](https://image.mono.ipros.com/public/product/image/a68/2000006078/IPROS6678126383975549471.jpg?w=280&h=280)
