We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Thermal Analysis Software.
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Thermal Analysis Software - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Oct 08, 2025~Nov 04, 2025
This ranking is based on the number of page views on our site.

Thermal Analysis Software Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Oct 08, 2025~Nov 04, 2025
This ranking is based on the number of page views on our site.

  1. PTI Kanagawa//Aviation & Aerospace
  2. null/null
  3. エヌ・エス・ティ Tokyo//software
  4. 4 null/null
  5. 5 ミューテック Tokyo//software

Thermal Analysis Software Product ranking

Last Updated: Aggregation Period:Oct 08, 2025~Nov 04, 2025
This ranking is based on the number of page views on our site.

  1. Thermal analysis software Thermal Desktop/SINDA PTI
  2. Structural and Thermal Analysis Software Ansys Mechanical
  3. 熱解析ソフトウェア Femap/Thermal
  4. Fast and easy, thermal analysis!!! 【Thermal Analysis Solver】 エヌ・エス・ティ
  5. 4 熱解析ソフト 【μ-EXCEL 誘導加熱版】 ミューテック

Thermal Analysis Software Product List

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Fast and easy, thermal analysis!!! 【Thermal Analysis Solver】

I am good at radiation calculations.

Femap Thermal can perform thermal analysis faster than finite element method solvers by using the finite difference method. Customers currently using Simcenter Femap who wish to conduct thermal analysis can do so by adding it to their existing Femap environment. 【Product Features】 ○ High-speed thermal radiation calculations. In particular, using an OpenGL-compatible GUI to compute with the Hemicube method allows for rapid calculation of form factors. ○ Consideration of temperature-dependent material properties is possible. ○ The consideration of Joule heating is possible. ○ By adding the Advanced Thermal extension module, it is possible to conduct more advanced thermal analyses, including considerations for reflection, refraction, absorption, and transmission of transparent bodies, as well as satellite orbit analysis. 【Types of Analysis Possible】 ○ Steady-state heat conduction analysis, transient heat conduction analysis ○ Flow network: Convection heat transfer analysis without fluid analysis ○ Thermal radiation analysis ○ Ray tracing ○ Joint models ○ Joule heating ○ Orbital thermal analysis/sunlight analysis ○ Model degradation ◎ For more detailed information, please refer to the catalog or contact us directly.

  • Other analyses

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Thermal analysis software Thermal Desktop/SINDA

It is a thermal analysis software that is in high demand in the aerospace field. Developed by NASA, it is a tool that is particularly strong in thermal analysis of spacecraft such as artificial satellites.

Thermal Desktop/SINDA is a PC-based thermal analysis integrated system. The pre-post processing feature, Thermal Desktop, operates as a plugin for AutoCAD and is a powerful tool for model building. The solver feature, SINDA/FLUINT, is a Fortran-based solver that includes one-dimensional thermal fluid analysis capabilities.

  • Company:PTI
  • Price:1 million yen-5 million yen
  • Thermo-fluid analysis
  • simulator
  • Analysis Services

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[Example] Thermal conduction analysis using thermal coupling functionality

We analyzed the temperature distribution of heat conduction due to heat generation from the chip in a structure composed of a chip, substrate, edge guide, and case.

**Case Overview** ■Product Name: Femap Thermal ■Analysis: Thermal Analysis ■Industry: Mechanical Components Modeling can be challenging when it comes to thermally connecting components due to thermal resistance from contact or thermal conduction at adhesive points. By using the thermal coupling feature, it is possible to define conductive conductance, thermal conductivity, or thermal resistance values between distant meshes that do not share nodes, allowing for thermal coupling between these meshes in calculations. This is an excellent feature that automatically considers the positional relationships of elements and allocates the degree of thermal coupling for each element. In this analysis case, we will analyze the temperature distribution due to heat generation from a chip in a structure consisting of four types of components: chip, substrate, edge guide, and case. The adhesion between the chip and substrate, as well as the edge guide that connects the substrate and case, were modeled using thermal coupling. □ For other functions and details, please refer to the catalog.

  • Other analyses

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熱解析ソフト 【μ-EXCEL 誘導加熱版】

材料特性は磁場解析と温度解析用が必要!高周波コイルは加熱ON/余熱OFFが設定できます!

IHクッキングは誘導加熱原理を使っています。高周波コイルで発生した磁場をお鍋の底に当てると渦電流が発生します、ここまでが磁場解析。渦電流は発熱を起こしお鍋の底からお水へ熱が伝わり温度が上昇します、ここは熱解析。誘導加熱は狙った場所を短時間で加熱できるので、様々なところに利用されています 詳細は【解析ノウハウ.com】の「NO.019 ex誘導加熱版の紹介 」をご覧ください ポイントはこちら ・誘導加熱によりワークの温度変化を見ます ・渦電流は磁場解析で求めるのでモデルに空間が必要 ・渦電流はワーク表面を薄く流れるので、メッシュを細かく ・材料特性は磁場解析と温度解析用が必要 ・高周波コイルは加熱ON/余熱OFFが設定できる

  • Other analyses

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